Crack and vent defects often result during the integrated circuit (IC) manufacturing process, particularly after wafer dicing.  Detection and classification may be challenging for inspection systems employing visible light illumination and optics as these defects may spread under the chip surface partially or completely.   With a SWIR Modular Microscope System (MMS) and a suitable SWIR Camera, both crack and vent defects, as well as other subsurface structures are easily visible.

Below are images of an IC containing cracks.  Under visible light the extent of the defect and damage is impossible to see. Using Short Wave Infrared (SWIR) illumination, optics and a suitable camera the full extent of the crack can be see as well as its impact on the IC.

Follow this link if you wish to learn more about WDI’s SWIR Modular Microscope System (MMS) or contact sales@wdidevice.com.